Manufacturing Capabilities
12 automated SMT lines, 300k CPH and components down to 01005 — the machines, processes and people behind your boards.
What Our Lines Can Handle
From fine-pitch chips to heavy through-hole assemblies — one factory covers the range.
High-Speed Placement
300k CPH across 12 automated lines with double-rail support.
Fine Pitch & BGA
Components down to 01005; BGAs with X-ray inspection.
High-Mix, Low-Volume
Flexible setup — from 1-piece prototypes to high volume.
Full Traceability
MES tracks every board, batch and reflow profile.
Multi-Layer Boards
Up to 30 layers, 600 × 500 mm max panel size.
Surfaces & Finishes
HASL, ENIG, OSP and ENEPIG surface finishes.
Core Parameters [PLACEHOLDER]
Sample values for reference — confirm actual specs before quoting.
Technical Specifications
Reference values only — final specs depend on your files and the confirmed engineering review.
| Board layers | 2 – 30 layers | Max panel size | 600 × 500 mm |
|---|---|---|---|
| Min. line / spacing | 3 / 3 mil | Min. drill hole | 0.2 mm |
| Board thickness | 0.4 – 3.2 mm | Surface finish | HASL / ENIG / OSP / ENEPIG |
| Placement speed | 300k CPH | Placement accuracy | ±25 μm |
| Smallest component | 01005 | Solder mask color | Green / Blue / Black / White |
| Testing coverage | SPI · AOI · ICT · FCT · X-Ray | Inspection standard | IPC-A-610 |
Sample certifications shown for layout — to be confirmed with actual certificates on file. [PLACEHOLDER]
Is your board within these specs?
Send your GERBER and BOM — we will confirm what our lines can do and quote within 24 hours.
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